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acmd-7612 miniature umts band i duplexer data sheet description the avago acmd-7612 is a miniature duplexer designed for use in umts band i handsets. maximum insertion loss in the tx channel is only 1.5 db, which minimizes current drain from the power amplifer. insertion loss in the rx channel is a maximum of 2.0 db, improving receiver sensitivity. the acmd-7612 enhances the sensitivity and dynamic range of wcdma receivers by providing more than 53 db attenuation of the transmitted signal at the receiver input and more than 43 db rejection of trans - mit-generated noise in the receive band. the acmd-7612 is designed with avago technologies film bulk acoustic resonator (fbar) technology, which makes possible ultra-small, high-q flters at a fraction of their usual size. the excellent power handling capabil - ity of the fbar bulk-mode resonators supports the high output power levels needed in handsets while adding virtually no distortion. the acmd-7612 also utilizes avago technologies in - novative microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assem - bled in a molded chip-on-board module that is less than 1.2 mm high with a maximum footprint of only 2.5 mm x 3.0 mm. features ? miniature size - 2.5 x 3.0 mm max footprint - 1.2 mm max height ? high power rating - +33 dbm abs max tx power ? lead-free construction specifcations ? performance guaranteed C30 to +85c ? rx band performance (2110 C 2170 mhz) - insertion loss: 2.0 db max - noise blocking: 43 db min ? tx band performance (1920 C 1980 mhz) - insertion loss: 1.5 db max - interferer blocking: 53 db min applications ? handsets or data terminals operating in the umts band i frequency range functional block diagram ant port 3 rx port 2 tx port 1
2 acmd-7612 specifcations, z 0 = 50 , t c [1] as indicated C30 to +85c [2] symbol parameter units min typ [3] max antenna port to receive port s23 insertion loss in receive band (2110 C 2170 mhz) db 1.1 2.0 fs23 ripple (p-p) in receive band db 0.6 1.0 fs23 ripple (p-p) in any 5 mhz channel within receive band db C 0.5 s22 return loss of receive port in receive band db 10 16 s23 attenuation 0 C 1900 mhz db 30 50 s23 attenuation in transmit band (1920 C 1980 mhz) db 53 61 s23 attenuation in bluetooth band (2400 C 2500 mhz) db 40 54 transmit port to antenna port s31 insertion loss in transmit band (1920 C 1980 mhz) -30 to +25c db 1.1 1.5 s31 insertion loss in transmit band (1920 C 1980 mhz) +25 to +85c db 1.1 1.6 fs31 ripple (p-p) in transmit band db 0.4 1.0 fs31 ripple (p-p) in any 5 mhz channel within transmit band db C 0.5 s11 return loss of transmit port in transmit band db 10 20 s31 attenuation 0 C 1800 mhz db 30 44 s31 attenuation in receive band (2110 C 2170 mhz) db 41 52 s31 attenuation in bluetooth band (2400 C 2500 mhz) db 25 31 s31 attenuation in transmit 2nd harmonic band (3840 C 3960 mhz) db 25 36 s31 attenuation in transmit 3rd harmonic band (5760 C 5940 mhz) db 15 17 antenna port s33 return loss of antenna port in transmit and receive bands db 10 17 isolation transmit port to receive port s21 tx-rx isolation in transmit band (1920 C 1980 mhz) db 53 62 s21 tx-rx isolation in receive band (2110 C 2170 mhz) db 43 52 notes: 1. t c is the case temperature and is defned as the temperature of the underside of the duplexer where it makes contact with the circuit board. 2. specifcations guaranteed over the given temperature range (unless otherwise noted) with the input power to the tx port equal to or less than +29 dbm over all tx frequencies. 3. typical data is the arithmetic mean value of the parameter over its indicated frequency range at the specifed temperature. typical values may vary from part to part and over time.
3 absolute maximum ratings [1] parameter unit value storage temperature c -65 to +125 maximum rf input power to tx port dbm +33 maximum recommended operating conditions [2] parameter unit value operating temperature, t c [3] , tx power 29 dbm c -40 to +100 operating temperature, t c [3] , tx power 30 dbm c -40 to +85 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. the device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifcations. 3. t c is defned as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. figure 2. rx band insertion loss figure 1. tx band insertion loss acmd-7612 typical performance at t c = 25c figure 3. tx and rx port return loss figure 4. tx rejection in rx band and rx rejection in tx band 0 -0.5 -1.0 -1.5 -2.0 -2.5 1920 1930 1940 1950 1960 1980 1970 frequency (mhz) insertion loss (db) 0 -0.5 -1.0 -1.5 -2.0 -2.5 2110 2120 2130 2140 2150 2170 2160 frequency (mhz) insertion loss (db) 0 -5 -10 -15 -20 -25 1800 1900 tx rx 2000 2100 2200 2300 frequency (mhz) return loss (db) 0 -10 -30 -50 -20 -40 -60 1800 1900 tx rx 2000 2100 2200 2300 frequency (mhz) insertion loss (db)
4 figure 5. tx to rx isolation figure 10. rx rejection in bluetooth band (2400 C 2500 mhz) figure 9. tx rejection in bluetooth band (2400 C 2500 mhz) figure 8. tx third harmonic rejection figure 7. tx second harmonic rejection figure 6. antenna port return loss -40 -50 -60 -70 -80 1800 1900 2000 2100 2200 2300 frequency (mhz) insertion loss (db) 0 -5 -10 -15 -20 -25 1800 1900 2000 2100 2200 2300 frequency (mhz) return loss (db) -20 -30 -40 -50 -60 3.80 3.85 3.90 3.95 4.00 frequency (ghz) insertion loss (db) 0 -10 -20 -30 -40 5.7 5.8 5.8 5.9 5.9 6.0 6.0 frequency (ghz) insertion loss (db) -20 -30 -40 -50 2.40 2.42 2.46 2.44 2.48 2.50 frequency (ghz) insertion loss (db) -40 -50 -60 -70 2.40 2.42 2.46 2.44 2.48 2.50 frequency (ghz) insertion loss (db)
5 figure 13. tx and rx wideband response figure 12. rx low frequency rejection figure 11. tx low frequency rejection -20 -30 -50 -70 -40 -60 -80 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 frequency (ghz) insertion loss (db) -20 -30 -50 -70 -40 -60 -80 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2.0 1.8 frequency (ghz) insertion loss (db) 0 -10 -30 -50 -20 -40 -60 0 1 tx tx rx rx 2 3 4 5 6 frequency (mhz) insertion loss (db)
6 figure 14. tx impedance (s11) in tx band figure 16. ant impedance (s33) in tx band figure 15. rx impedance (s22) in rx band figure 17. ant impedance (s33) in rx band 0. 4 -0.4 0. 6 -0.6 0. 8 -0.8 1. 0 -1.0 1. 5 -1.5 2 -2 3 -3 4 -4 5 -5 10 -1 0 20 -2 0 50 -5 0 0. 4 0. 2 0. 6 0. 8 1. 0 1. 5 2 3 4 5 10 20 50 0. 4 -0.4 0. 6 -0.6 0. 8 -0.8 1. 0 -1.0 1. 5 -1.5 2 -2 3 -3 4 -4 5 -5 10 -10 20 -20 50 -5 0 0. 4 0. 2 0. 6 0. 8 1. 0 1. 5 2 3 4 5 10 20 50 0. 4 -0.4 0. 6 -0.6 0. 8 -0.8 1. 0 -1.0 1. 5 -1.5 2 -2 3 -3 4 -4 5 -5 10 -10 20 -20 50 -5 0 0. 4 0. 2 0. 6 0. 8 1. 0 1. 5 2 3 4 5 10 20 50 0. 4 -0.4 0. 6 -0.6 0. 8 -0.8 1. 0 -1.0 1. 5 -1.5 2 -2 3 -3 4 -4 5 -5 10 -10 20 -20 50 -5 0 0. 4 0. 2 0. 6 0. 8 1. 0 1. 5 2 3 4 5 10 20 50
7 figure 18. package drawing figure 19. package marking an t p p ackage orient at io n tx rx p = acmd-761 2 fb = av ago id y = ye ar ww = wo rk we ek dc = date code nnnn = lot number product marking pa ckag e orien tat io n an t rx tx notes : 1. dimensions in millimeters 2. nominal unless otherwise noted 3 4 5. t olerance: x.x = 0.1 x.xx = 0.0 5 6. contact areas are gold plate d dimensions . all chamfers 45 . i/o pads (3 ea) size: 0.53 x 0.53, corner chamfers: 0.03 x 0.0 3 spacing to ground plane: 0.3 4 inside ground plane chamfer: 0.20 x 0.2 0 3.0 ma x 2. 5 ma x 2.80 2.3 0 2.27 1. 2 ma x 0.53 0.3 4 0.53 0.53 0.3 4 0.20 0.53 0.3 4 0.3 4 0.53 0.3 4 0.3 4 0.20
8 figure 20. pcb layout a pcb layout implementing design principles similar to those illustrated in figure 16 is recommended to optimize performance of the acmd-7612. it is particularly important to maximize isolation between the tx connection to the duplexer and the rx port. high isolation is achieved by (1) maintaining a continuous ground plane around the duplexer mounting area, (2) surrounding the i/o ports with sufcient ground vias to enclose the connections in a faraday cage, and (3) preferably routing the tx trace in a diferent metal layer than the rx. the latter is especially useful, not only to maintain tx- rx isolation of the duplexer, but also to prevent leakage of the tx signal into other components that could result in the creation of intermodulation products and degradation of overall system performance. figure 21. acmd-7612 superposed on pcb layout ant r x tx 2.27 1.78 g w ? 0.20 via array horiz pitch = 0.33 vert pitch = 0.38 ? 0.20 via array horiz pitch = 0.38 notes: 1. dimensions in mm. 2. transmission line gap (g) and width (w) adjusted for zo = 50 ohms. 3. i/o pads (3 ea) 0.53 x 0.53, corner chamfer 0.30. 4. i/o pad to ground plane gap = 0.34, corner chamfer 0.30. 5. ground vias positioned to maximize port-to-port isolation. vert pitch = 0.33 ? 0.20 via array horiz pitch = 0.38 ? 0.20 via array horiz pitch = 0.33 vert pitch = 0.38 0.10 0.10
9 figure 22. recommended solder mask figure 25. solder stencil overlaid on acmd-7612 bottom metal pattern figure 24. recommended solder stencil figure 23. acmd-7612 superposed on solder mask 2.90 2.40 > 0.30 typ. > 0.30 typ. 0.24 0.63 0.63 0.24 note: dimensions in mm . a c b a a b 2.80 2.30 stencil boundar y 0.15 0.15 stencil opening id qty width (mm) length (mm) c 1 0.77 1.24 b 2 0.50 1.24 a (i/o pad areas) 3 0.43 0.4 3 notes: 1. chamfer or radius all corners 0.05 mm min. 2. stencil openings aligned to boundary rectangle or center lines.
10 figure 26. smd tape packing figure 27. unit orientation in tape section b ? b section a ? a r0.60 typ . 5 (max.) ko bo ao ? 1.50 (min.) ? 1.55 0.05 2.00 0.05 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 (see note #2) 8.00 0.10 notes: 1. ao and bo measured at 0.3 mm above base of pocket. 2. 10 pitches cumulative tolerance 0.2 mm. 3. ( ) reference dimensions only . ao = 2.80 bo = 3.30 ko = 1.50 pitch = 8.00 width = 12.00 0.30 0.05 sprocket holes tape width pocket cavity package pin 1 orientation p p p
figure 29. reel drawing, front view figure 28. reel drawing, back view reel component resistivity reel (coated with proprietary antistatic agent) 10^9 to 10^11 ohm/sq carrier tape (carbon polystyrene) 10^9 ohm/sq cover tape top layer C transparent pet flm bonding layer C adhesive polyolefn sealing layer C peelable, special flm 10^9 to 10^11 ohm/sq notes: 1. reel shall be labeled with the following information (as a minimum): a. manufactures name or symbol b. avago technologies part number c. purchase order number d. date code e. quantity of units 2. a certificate of compliance ? of c) shall be issued and accompany each shipment of product. 3. reel must not be made with or contain ozone depleting materials. 4. all dimensions in millimeters (mm) .
package moisture sensitivity feature test method performance moisture sensitivity level (msl) at 260c j-std-020c level 3 figure 30. verifed smt solder profle acmd-7612 ordering information part number no. of devices container ACMD-7612-BLK 25 anti-static bag acmd-7612-tr1 1000 178 mm (7-inch) reel for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2007 avago technologies limited. all rights reserved. av02-0473en - september 25, 2007 300 250 150 50 200 100 0 0 5 0 100 150 200 250 300 time (seconds) temperture ( c) tested profile shown.

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